More robust than the XT filament with a higher resistance to temperature but more difficult to work with. Therefor the use of these filaments are directed at advanced users.
ColorFabb_HT bears improved resistance to temperatures and is very robust, which is required for special components.
To ease the application it is important to adjust the settings for the first layer accordingly.
A heating board temperature between 110°C to 120°C and in some cases the use of adhesive tools are recommended. (e.g. BuildTak)
COLORFABB NGEN
COLORFABB_XT
COLORFABB_HT
Processing temperature
220C / 240C
240C / 260C
250C / 280C
Heated buildplate
75C / 85C
65C / 75C
100C / 110C
Temperature resistance
85C
75C
100C
Processing window
+++
+
+
Printing speed
+++
+
+
Toughness
+
++
+++
More information about the material can be found here: ColorFabb_HT